APPLICATION NOTE I(국문)

Semiconductors & Electronics Other Images Wire bonding (x1,500) Si wafer (x1,000) IC Chip tilted 45° (x300) PKG epoxy (x1,000) Solder ball (x300) Chip layer (x5,000) PCB mount (x100) PCB (x3,000) Semiconductor surface (x2,000) Nanowires (x1,000) PKG epoxy (x1,000) Stitch bonding (x1,000) 19 www.coxem.com